Developments

UPM Raflatac launches world’s first certified label material to fight ocean bound plastic pollution

Kuala Lumpur– UPM Raflatac has launched Ocean Action labels, the world’s first label made from Ocean Bound Plastics (OBP) sourced predominately from Malaysia using a mass balance approach. Mass balancing means enabling the gradual shift to a sustainable economy by allowing fossil and virgin materials to be replaced with sustainable ones, like recycled plastics waste. The new innovative label material is made possible through a collaboration with multiple partners including Malaysia’s Heng Hiap Industries (HHI), Saudi Basic Industries Corp (SABIC) and Taghleef Industries. UPM Raflatac is a global producer of labelling materials from Finland. In Malaysia, it has a manufacturing plant in Pasir Gudang, Johor. UPM Raflatac is leading in sustainable labelling through its innovative self-adhesive label materials and services. The Ocean Action label material is available as white and clear top-coated polypropylene (PP) films. Complete with Forest Stewardship Council (FSC)-certified glassine and post-consumer recycled content (PET PCR) liners, it is a robust sustainable solution. These label materials are a perfect fit for fast-moving consumer goods (FMCG), such as household goods, personal care, packaged foods, and beverages. Ocean bound plastic is abandoned plastic waste recovered from areas up to 50km inland from waterways, defined as “at risk of ending up in the ocean” by Ocean Bound Plastic Certification (OBPCert) under the Zero Plastics Oceans NGO. According to World Wildlife Fund (WWF), 60% of the estimated 8 million tonnes of plastic that enter the world’s oceans each year is contributed by China, Indonesia, Malaysia, the Philippines, Thailand and Vietnam. Malaysia ranked highest among the six countries analysed in terms of annual per-capita plastic packaging consumption, at about 16.8 kg per person. According to a Science Advances study, more than a thousand rivers are accountable for 80% of plastic waste found in the ocean, with the Klang River named among the top contributors[3]. […]

Asia-Pacific most receptive to smart manufacturing usage globally

Companies believe smart manufacturing is key to their business’ future success, The State of Smart Manufacturing Report reveals. Plex Systems, a Rockwell Automation company in cloud-delivered smart manufacturing solutions, has announced the results of its 7th annual study, “The State of Smart Manufacturing Report.” The research reveals that smart manufacturing adoption accelerated by 50% globally in 2021, and these new technologies are now solving the industry’s critical challenges. Asia-Pacific (APAC) organisations (93%) view smart manufacturing as “very” or “extremely” important to future success, compared to North America (NA) (84%) and Europe, Middle East, and Africa (EMEA) (75%). Reflecting their optimistic attitude towards smart manufacturing, most APAC companies reported a shorter timeframe – “within the next 7 to 11 months” – for adoption of smart manufacturing solutions, compared with NA and EMEA’s majority response of “within the next 1-2 years”. The global study surveyed more than 300 manufacturers in a variety of industries including automotive, aerospace, food and beverage, electronics, consumer goods, plastics and rubber, precision metal forming, and more. This year’s report, conducted in collaboration with Hanover Research, offers valuable insights into trends, challenges, and future plans for global manufacturers. The report aims to help manufacturers benchmark their technology strategy and incorporate smart manufacturing best practices to stay competitive and thrive. A scalable technology strategy makes it possible to incrementally adopt solutions and achieve value quickly. As manufacturers look to streamline processes and solve today’s challenges, they are placing significant value on using smart technology to address and improve actual business outcomes. The report’s findings show the pandemic both exposed and exacerbated pre-existing conditions in manufacturing. Skilled worker shortages, competition, and supply chain disruptions are the top three challenges being faced by Asia-Pacific companies because of the pandemic. With that in mind, nine in 10 APAC respondents (93%) believe smart […]

FlexView lens to provide thermographers with two lenses in one

The FlexView dual field-of-view (DFOV) lens attachment for FLIR Axxx and Txxx Series thermography cameras are designed to improve operational efficiency, safety, and accuracy from switchyards to the plant floor. With a single form factor just 6mm longer than the standard single-lens setup, operators now can have two lenses without adding weight while enjoying a smoother experience operating the camera and reducing inspection time in the field. FlexView also offers fully radiometric performance and imaging quality, resulting in the ability to measure and record the temperature of every pixel in the scene for improved decision support. With two lenses in one, thermographers can improve their inspection results, while improving safety, reducing inspection time, and eliminating risk of lens or camera damage during lens changeover. The 24-degree wider field-of-view lens within the FlexView offers wide area scanning to detect potential anomalies, while the narrower 14-degree field of views lens delivers pinpoint accuracy with 2.8 times as many pixels on target thanks to the increased optical zoom. More pixels on target means greater accuracy. This is all achieved programmatically via software for fixed cameras, or a simple press of a button for portable cameras. The FlexView DFOV Lens can also minimise risk in the field—as fewer lens changes mean users are less likely to damage sensitive camera parts while staying focused on the task at hand. With the ability to get more pixels on target versus a single lens system, operators can also increase the distance between themselves and potentially dangerous equipment. This will help the operator avoid arch flashes or exposure to compromised equipment all without sacrificing accuracy or missing potential issues. The Teledyne FLIR FlexView lens is available for purchase globally from Teledyne FLIR.

Embedded World 2022: IBASE showcases AMD Ryzen Embedded R2000 Processors

IBASE Technology Inc. announces its newest board, digital signage player and uCPE/SD-WAN appliance based on the latest AMD Ryzen Embedded R2000 processors at Embedded World 2022. AMD Ryzen Embedded R2000 Series processors are built on the groundbreaking ‘Zen+’ x86 core architecture based on 14nm process technology, advanced Radeon Graphics and high-speed I/Os, offering a strong performance upgrade from the R1000 Series.-. Delivering graphics performance with up to 8 CUs and optimized performance-per-watt efficiency with TDP ranging from 12-54 watts, the AMD Ryzen Embedded R2000 series processors target embedded and industrial computing platforms requiring scalability, longer lifecycle and extended temperature support,” said Amey Deosthali, Director of Product Management, Adaptive & Embedded Computing Group at AMD.

Atlas Copco opens new vacuum pump manufacturing facility in Asan City, South Korea

Edwards, part of the Atlas Copco Group, has today inaugurated a new manufacturing facility for vacuum pumps used in the global manufacture of semiconductors. The factory is situated in Asan City, in Chungcheongnam-do province, South Korea. Semiconductor manufacturing is essential to supporting developments across the technology, electronics, automotive, scientific and healthcare sectors. A recent surge in demand has seen widespread investment in global semiconductor manufacturing capability. The investment in the new Korea facility represents a significant step forward in ensuring the supply chain capacity required to support that growth. ”Our new vacuum pump factory in Korea will play a critical role in supporting our customers as they seek to respond to the growth in global demand for semiconductors,” said Geert Follens, Business Area President Vacuum Technique. Environmental sustainability has been a key consideration in the construction of the new 16,000 m2 facility, which utilises advanced data technology and state-of-the-art manufacturing equipment. The new factory began production this month and will provide job opportunities for around 150 people.

Secutech Vietnam 2022 caters to growing market for security solutions

Security, fire safety and smart building industry players are busy planning their trips to Secutech Vietnam as the countdown to the 2022 edition enters its final two months. Excitement is also rising among overseas participants after the Vietnamese government recently reopened borders for international tourism in March and lifted pre-departure COVID-19 test requirements for vaccinated travellers. Highly anticipated by the industry, this year’s Secutech Vietnam has signed up a large contingent of major international and domestic brands, and has confirmed overseas pavilions from Japan and Singapore. Huge demand for fire safety, smart building and security solutions is expected at the fairground after a number of large industrial zones were set up across the country from the beginning of this year[1]. Local and overseas developers are also showing a great deal of enthusiasm to establish major residential, industrial and commercial property projects in Ho Chi Minh City[2]. According to a recent report, Vietnam will remain one of the best investment destinations for industrial real estate in Southeast Asia over the next 10 years and beyond[3]. Meanwhile, smart city projects are underway in municipalities across the country, including in Hanoi, Da Nang, Ho Chi Minh City and Binh Duong. On the back of this favourable business environment, this year’s Secutech Vietnam will provide a great opportunity for exhibitors, distributors, property developers and system integrators to re-engage with each other. The 2022 edition takes place from 18 – 20 August at the Saigon Exhibition and Convention Centre in Ho Chi Minh City. As the region’s most influential trade fair for comprehensive security, fire safety and smart building solutions, Secutech Vietnam provides an unrivalled gateway for domestic and overseas players to gather genuine business leads and find cutting-edge technologies. The show has confirmed participation from many key industry brands such as AVIGILON (Motorola), ASTEC, […]

Mitsubishi Corp signs agreement for carbon sequestration

Mitsubishi Corporation has signed a participation agreement with Sempra Infrastructure, TotalEnergies and Mitsui & Co., Ltd. for the development of the proposed Hackberry Carbon Sequestration (HCS) project at the site in Southwest Louisiana. The project aims to capture, transport and sequestrate carbon dioxide (CO2), primary sourced from Cameron LNG, and the participation agreement provides the basis for the parties to potentially enter into a joint venture with Sempra Infrastructure for the HCS project. Last summer, the Hackberry Carbon Sequestration, LLC, which is owned by Sempra Infrastructure, filed an application for a Class VI injection well permit from the U.S. Environmental Protection Agency for permanent storage of up to 2 million tonnes per annum of CO2. As underpinned in both Roadmap to a Carbon Neutral Society and Midterm Corporate Strategy 2024, announced in October 2021 and May 2022 respectively, MC is placing greater emphasis on energy transformations (EX). By lowering the carbon footprint throughout the LNG value chain through CCS and other EX initiatives, MC hopes to spearhead future transformations and help societies to decarbonise by providing a stable supply of clean energies. “We are thrilled to participate in a business opportunity that could potentially lower the carbon intensity of LNG produced from the Cameron LNG Project, through which we will be able to provide additional value to our customers,” said Masaru Saito, Senior Vice President and Division COO, North America Div., Mitsubishi Corporation. “CCS promises to play an important role in achieving net-zero emissions on a global scale, so we are excited about making this project happen and looking forward to expanding our CCS business portfolio.” The development of the HCS project is subject to risks and uncertainties, including signing definitive agreements, securing all necessary permits, and reaching a final investment decision.

Embedded system powered by AMD Ryzen Embedded V2000 Processor

IBASE Technology Inc. has unveilled its CMI211-989 embedded system powered by AMD Ryzen Embedded V2000 processors based on the innovative “Zen 2” x86 core architecture using advanced 7nm manufacturing process. The system harnesses the power AMD Ryzen Embedded V2748/V2718 CPU with Radeon Graphics to enable 25% more PCIe lanes and deliver 40 percent better graphics performance over the previous generation SoC. CMI211-989 houses IBASE’s MI989 Mini-ITX motherboard supporting up to four independent 4K displays via DP 1.4 ports to create 3D immersive experiences in retail, gaming, and factory automation applications. Measuring 269(w) x 193(d) x 31.5(h) mm, it offers rich I/O connectivity, storage, expansion capabilities and supports 4x COM, 3x USB3.1, 2x USB2.0, a 2.5” drive bay and a PCIe(x16) slot for riser cards expansion. CMI211-989 has a planned product availability of 10 years and is suitable for use with operating systems such as Windows 10 (64-bit) / 8.1 (64-bit) / 7 (32-bit / 64-bit) and Linux Ubuntu (64-bit). CMI211-989 FEATURES: AMD Ryzen™ Embedded V2000 Series 4x DisplayPort 1.4 Supports 2x RS232 & 2x RS232/422/485 Dual Intel® Gigabit LAN 3x USB 3.1, 2x USB 2.0, 1x SATA III Expansion PCI-E(x16) slot Supports 1x 2.5″ SATA HDD drive bay and mSATA drive IBASE Technology specialises in the design and manufacture of robust industrial PC products, delivering high-quality products and excellent service since its establishment in 2000.

Global systems makers accelerate adoption of Grace and Grace Hopper

Monday, May 30, 2022 A range of the world’s leading computer makers are adopting the new NVIDIA Grace superchips to create the next generation of servers turbocharging AI and HPC workloads for the exascale era. Atos, Dell Technologies, GIGABYTE, HPE, Inspur, Lenovo and Supermicro are planning to deploy servers built with the NVIDIA Grace CPU Superchip and NVIDIA Grace Hopper Superchip. All these new systems benefit from the just-announced Grace and Grace Hopper designs in the NVIDIA HGX platform, which provide manufacturers the blueprints needed to build systems that offer the highest performance and twice the memory bandwidth and energy efficiency of today’s leading data center CPU. “As supercomputing enters the era of exascale AI, NVIDIA is teaming up with our OEM partners to enable researchers to tackle massive challenges previously out of reach,” said Ian Buck, vice president of Hyperscale and HPC at NVIDIA. “Across climate science, energy research, space exploration, digital biology, quantum computing and more, the NVIDIA Grace CPU Superchip and Grace Hopper Superchip form the foundation of the world’s most advanced platform for HPC and AI.” Early Adopters Leading InnovationLeading supercomputing centers in the U.S. and Europe will be among the first with systems featuring the superchips. Today, Los Alamos National Laboratory announced that Venado, its next-generation system, will be the first system in the U.S. to be powered by NVIDIA Grace CPU technology. Built using the HPE Cray EX supercomputer, Venado is a heterogeneous system that will feature a mix of Grace CPU Superchip nodes and Grace Hopper Superchip nodes for a wide and emerging set of applications. When completed, the system is expected to exceed 10 exaflops of AI performance. “By equipping LANL’s researchers with the performance of NVIDIA Grace Hopper, Venado will continue this laboratory’s commitment to pushing the boundaries of scientific breakthroughs,” said Irene […]

Partner companies announced

Rockwell Automation has announced the winning partner companies coming out of the inaugural PartnerNetwork Awards at the Asia-Pacific PartnerNetwork Conference 2022 held on May 18 and 19 in Singapore. The conference was an exclusive, invite-only event which saw the participation of close to 500 partners. It also included a virtual experience where attendees had access to live streams of keynote presentations and on-demand content post-event. Following the theme “Better Together,” the conference focused on redefining possibilities together with its partners, through collaboration, while reinforcing the value of the global community, to advance customer successes. From discussion sessions to engaging industry networking events, partners were on full display throughout the event, but especially during the first edition of the PartnerNetwork Awards. The awards showcase honors the achievements of organisations that have successfully planned and executed innovative and transformational solutions. These organisations have found ways to impact one or more areas of their business through the application of Rockwell Automation and other partners’ digital and disruptive technologies. “The quality of award submissions we received was truly impressive,” said Donald Shoemaker, regional vice president of global market access, Asia Pacific, Rockwell Automation. “Our partners in the region, across many industries, have worked together to not only help their customers transform digitally but also improve their manufacturing and supply chain processes, and build resilience to withstand unexpected disruptions.” Rockwell Automation would like to congratulate the winners, as well as all who entered: Distributor Partner of the Award Winner Systems Integrator Partner of the Year Award Winner Winners Automation (Korea) Greenwave Solutions (India) Distributor OT Innovation Award Winner Automation System Integrator Innovation Award Winner NHP Electrical Engineering Products (Australia) ATSYS (Australia) Distributor IoT Innovation Award Winner Information Software System Integrator Innovation Award Winner Ningbo Jetron Technology (China) Birlasoft (India) Distributor Customer Experience Award Winner System […]

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