Business News

  CHENGDU:Singapore-Sichuan Hi-Tech Innovation Park lays the foundation in Chengdu,the capital city of Sichuan province, Southwest China. Covering 10.34 square kilometers planning construction area at the South Park of Chengdu High Tech Development Zone (CDHT), the completion of the overall project is targeted by 2020. The total investment amounts to over 100billion RMB, while the direct investment of the joint venture company programs archives more than 20 billion RMB. In the construction period, Singapore Temasek Ltd will take the lead in theoperation, which will comprehensively rely on the present industrial foundationand open atmosphere of Chengdu as well as the advanced managerial experience and operation mode of Singapore. It is expected to integrate modern manufacturing, modern services and modern living, which turns the new park into a green community, a major regional business hub and a gateway for businesses expanding into West China. Specifically, the cooperation will focus on IT, digital media, biomedical, education, banking & finance. It is said that more than 120,000 people will choose to work and live there in future. The construction of Singapore-Sichuan Hi-Tech Innovation Park marks an historical milestone in further collaboration between Sichuan and Singapore. This is not only the first large-model cooperation in inland China with Singapore, but also the newly major starting project in Chengdu-Chongqing economic zone and Tianfu New Zone, largely supported by both Chinese and the Singapore government. A new report shows that Singapore’s investment in Sichuan, in the recent five years, has reached a tremendous growth, while the trade volume of both sides has increased by 5.5 times. Today, Singapore stays the fourth largest foreign investor in Sichuan and the very important trade partner from Southeast Asia. Chengdu-Chongqing economic zone and Tianfu New Zone are fully prepared for the further collaboration in Singapore-Sichuan Hi-Tech Innovation Park. Possibly sharing the same reason with 2013 Fortune Global […]

  SHANGHAI: Borosilicate glass is one of China’s focuses for development in its ready-to-release Outline of the 12th Five Year Plan for daily-use glass industry. It is widely used in laboratory glassware and cookware because of its high strength and heat resistance. As such specialty glass melts at a higher temperature, the manufacturing process consumes relatively more energy and fuel. Air Products (NYSE: APD), a leader in oxy-fuel combustion technology and integrated solution supplier to the global glass industry, recently signed a contract to supply its integrated oxy-fuel solution to Kunshan Yongxin Glassware (hereinafter referred to as “Yongxin”), one of the leaders in heat resistant glass making for microwave oven and the other home appliances in China, to improve productivity and reduce emissions. The integrated oxy-fuel solution includes the supply of Cleanfire(R) HRi (TM) oxy-fuel burners, automatic control skid for burners and PRISM(R) vacuum swing absorption (VSA) oxygen generator which will supply reliable and economical oxygen. In addition, Air Products provides consultation on furnace design, process and technique optimization with operation data analysis and solid experience to Yongxin. “Air Products is honored to have been Yongxin’s long-term supplier from its first trial on oxy-boosting in 2007 through today’s full conversion to oxy-fuel combustion”, said Richard Huang, Air Products’ Asia industry manager for Glass. “This is another success story on how our innovative solution and glass experts can help ChinaÕs glass makers address increasingly stringent environmental regulations while improving productivity, efficiency and quality.” An innovative combustion technology, Air Products’ integrated oxy-fuel solution brings glass manufacturers various benefits such as about 80% reduction of nitrogen oxide emissions, over 25% increase in productivity, reduction of capitals, 25-60% energy savings and improvement in efficiency and glass quality. With over 50 years of experience in oxy-fuel technology, Air Products offers an integrated oxy-fuel solution, from gases supply […]

  electronica China and productronica China welcomed 664 exhibitors from 19 countries in Shanghai. The number of exhibitors saw an increase of more than 38 percent compared to 2011. 41,847 visitors, 10 percent more than 2011, had a look on core technologies from renowned original leaders worldwide. The shows displayed the latest development of worldwide electronic industry and unveiled the future market opportunities. Mr. Zhang ShuQing, Senior Vice President of MMI Shanghai said,” electronica China and productronica China always have its uniqueness to display the foremost technologies and solutions from leading companies such as Infineon, IR, Komax, muRata, TE connectivity and Vicor. We are also very happy to serve fast growing Chinese electronics industry.” electronica China and productronica China covered the whole spectrum of the electronics industry, including IC, passive components and manufacturing equipment. Philip F.W.Harting, Senior Vice President Connectivity & Networks of Harting said about progress of the show: “I’m very satisfied with the fair. The number of exhibitors has increased dramatically from last year. This is a very positive development. And also the numbers of visitors were very positive. The Chinese market is becoming more and more important for us, because China is currently oriented on innovation.” Herve Branquart, Director Automotive solutions of On semiconductor BVBA commented, “Just a few minutes after the show’s kick-off, many of our key customers came to our booth. This show was getting more and more popular and there were a lot of engineers visiting us. We also met visitors from Beijing. This is a good sign that Shanghai could attract visitors from so far away. electronica China starts to be a well-known brand, and people can see here most key players from China.” At electronica China, visitors could find a range of global leaders from IC, passive component and power segment such […]

     SINGAPORE: Applied Materials Inc., global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, and the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), officially opened the Centre of Excellence in Advanced Packaging at Singapore’s Science Park II today. Singapore’s Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at today’s opening ceremony. The Centre of Excellence in Advanced Packaging has been built with a combined investment of over USD$100 million from Applied Materials and IME. The world-class facility features a 14,000 square foot Class-10 cleanroom and is equipped with a fully-integrated line of 300 millimetre manufacturing systems to support the research and development of 3D chip packaging, a critical growth area for the semiconductor industry. The Centre will be the most advanced lab of its kind dedicated to wafer level packaging and will combine Applied Materials’ leading-edge equipment and process technology with IME’s leading research capability in 3D chip packaging. The Centre positions Singapore as a global leader in semiconductor R&D and is expected to help accelerate the development and adoption of 3D packaging technology globally. Traditionally, chips are connected to packages using wires attached to only their edges. This approach limits the possible number of connections from the chip and the long wire connections result in signal speed delays and power inefficiencies. With 3D chip packaging, multiple chips can be stacked on top of each other and connected with wiring that runs vertically through the stack – called through-silicon vias (TSVs). When used to stack memory chips on logic chips, this technology is expected to reduce package size by 35%, decrease power consumption by 50%, and increase data bandwidth by a factor of eight or more times. Conceived to support […]

  By Doug Green Manufacturing environments are rapidly evolving due to global competition and changing customer requirements. This is from the Lead Article (Page 5) that in a very comprehensive way describes the need to maintain competitiveness and look after critical business decisions in Asia, South Pacific regions. So how is your company managing this? Vehicle manufacturers seem to be pretty much on to it and I am always being informed of key refinements to manufacturing environments, especially from South Korea. So have your say as well and email words@xtra.co.nz and we will publish your observations and share your manufacturing methods with our readers around the world. We also look at Product Data Management (PDM) and the need to look at such an integrated system (Page 19). There is no point wasting valuable time looking for or recreating designs that already exist, which can put your company at a competitive disadvantage. Using existing designs can save time and money and bring new products to market faster. A fascinating read! Energy conservation and environmental protection is now the catch phrase for sustainable global growth. Do you agree with that observation? In China the State Council is looking at ways for sustainable growth by developing an innovative model. So Speeding up Green Technology in China (Page 30) describes a campaign underway to do better business environmentally. This is a sound initiative especially with economic indicators around the globe showing a slowdown of activity. Seizing the moment is definitely the way to go. Our Asia Pacific economies face huge challenges. And that’s okay – through issues arising new opportunities are created. Let us all grab hold of 2012 and make it a successful business year.  

  Twain Drewett, managing director Rockwell Automation says that the Frost and Sullivan Award for Company of the Year for PLCs recognises the commitment that Rockwell Automation has made to develop a product that meets customer’s needs. Rockwell Automation has received the prestigious 2011 Frost and Sullivan Company of the Year Award for the Programmable Logic Controller in the South Pacific and South East Asia region. The award recognises the leading role Rockwell Automation has played in developing cost-effective technology solutions with improved safety for programmable logic controllers (PLCs). It also confirms the commitment Rockwell Automation has made to the industry and the companyÕs position as a major participant in automation systems across many industries. To qualify for the award, a company is measured on five key criteria: market share position, growth implementation, degree of innovation with products and technologies, gain in market share and leadership in customer value. Rockwell Automation scored consistently high in all five categories for the South East Asia, Australian and New Zealand region. “Rockwell Automation winning this award confirms that the company’s customer value strategies are recognised by the automation industry, and in turn by the broader market,” said Twain Drewett, managing director Rockwell Automation Australia and New Zealand. “The PLC is continuing to evolve into a product that meets the customer’s requirements for plant-wide optimisation and sustainable production, while simultaneously helping to converge the IT arena into the manufacturing space. This value-add of Rockwell Automation Customer Services and Solutions and the strength of our network of partners, has provided the PLC with ‘Best in Class’ differentiation,” concluded Drewett. The Company of the Year Award, now in its fourth year, is presented by Frost and Sullivan, a global industry analyst and growth consulting company with nearly 50 years experience. Frost and Sullivan are specialists in […]

  If your company has business news and developments, they are most welcome in ASIA MANUFACTURING NEWS

  Delcam held its annual Asian Technical Summit in Zhuhai, China, from 6th to 8th September as part of the celebrations of the fifteenth anniversary of the founding of its Delcam China subsidiary. The Summit is held each year to present the latest developments from the company to its leading customers, academicians and the technical media in the region. This year’s meeting, which was sponsored by HP, was the eleventh in the series and the second to be held in China. Close to 200 delegates attended, mainly from China but also from 10 other countries. The Summit featured presentations on the latest versions of Delcam’s range of CAM systems before their official launch at the EMO exhibition. Updates were also included on the other software in the Delcam portfolio, including the company’s design and inspection programs, plus the dedicated software for the footwear, orthotics and dental industries. Guest speakers alongside the Delcam presentations included Alastair Morgan, Consul General from the UK Consulate in Guangzhou, Kexin Chu, CEO/Chairman of First Auto Works Die Manufacturing Co., Ltd., Marco Kormann from Adidas Group, and Naoto Kitayama from Japan’s Tatematsu Mold Co. Ltd. Delcam formed its Delcam China subsidiary in 1996 after making initial sales into the country through its joint ventures in Taiwan and Hong Kong. Delcam China now employs more than 50 staff in its headquarters in Beijing and regional offices in Shanghai, Shenzhen, Chengdu, Xi’an, Wenzhou, Qingdao and Quanzhou. In addition, the Delcam Hong Kong and Delcam Taiwan joint ventures operate two offices each in mainland China, and there are more than 30 reseller offices in the country. The Summit comes at a time when Delcam is setting new records for its business in China. Sales of software have increased by more than 50% in the first half of this year […]

Hong Kong: Metallurgical Corporation of China Ltd. (“MCC” or the “Company”, SEHK: 1618) is pleased to announce its unaudited interim results for the six months ended 30 June 2011 (the “first half of 2011” or the “Reporting Period”). — Revenue amounted to RMB105,838 million, representing a year-on-year increase of RMB16,988 million or 19.12%. — Gross profit for the period amounted to RMB9,879 million, representing a year-on-year increase of RMB1,038 million or 11.74%. — Basic earnings per share amounted to RMB0.10. — The total assets amounted to RMB319,206 million, representing an increase of RMB30,985 million or 10.75% as at 31 December 2010. — Newly-signed contract value amounted to RMB165,713 million, representing a year-on-year increase of 6.2% from 2010, including USD1,389 million of newly-signed overseas contracts. During the first half of 2011, the Company’s revenue amounted to RMB105,838 million, representing an increase of 19.12% as compared to 30 June 2010 (the “same period last year”). Gross profit of the Company amounted to RMB9,879 million, representing a year-on-year increase of 11.74%. Profit attributable to equity holders of the Company amounted to RMB1,969 million, representing a decrease of 11.47% compared to the same period last year. Basic earnings per share amounted to RMB0.10. Total assets as at 30 June 2011 amounted to RMB319,206 million, representing an increase of RMB30,985 million as compared to 31 December 2010. Total equity amounted to RMB55,495 million, representing an increase of 3.71% as compared to 31 December 2010. Newly-signed contract value amounted to RMB165,713 million, representing a year-on-year increase of 6.2% from 2010, including USD1,389 million of newly-signed overseas contracts. Reviewing the first half of 2011, the Company continued to expand its presence in the non-metallurgical engineering markets such as housing construction as well as transport infrastructure in addition to strengthening its edges over metallurgical engineering and construction. Meanwhile, […]